JPH0727649Y2 - 放熱基板に取り付けられた抵抗体を備えた印刷配線板 - Google Patents
放熱基板に取り付けられた抵抗体を備えた印刷配線板Info
- Publication number
- JPH0727649Y2 JPH0727649Y2 JP1989130135U JP13013589U JPH0727649Y2 JP H0727649 Y2 JPH0727649 Y2 JP H0727649Y2 JP 1989130135 U JP1989130135 U JP 1989130135U JP 13013589 U JP13013589 U JP 13013589U JP H0727649 Y2 JPH0727649 Y2 JP H0727649Y2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- printed wiring
- wiring board
- heat dissipation
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000009751 slip forming Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989130135U JPH0727649Y2 (ja) | 1989-11-09 | 1989-11-09 | 放熱基板に取り付けられた抵抗体を備えた印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989130135U JPH0727649Y2 (ja) | 1989-11-09 | 1989-11-09 | 放熱基板に取り付けられた抵抗体を備えた印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0369265U JPH0369265U (en]) | 1991-07-09 |
| JPH0727649Y2 true JPH0727649Y2 (ja) | 1995-06-21 |
Family
ID=31677727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989130135U Expired - Lifetime JPH0727649Y2 (ja) | 1989-11-09 | 1989-11-09 | 放熱基板に取り付けられた抵抗体を備えた印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727649Y2 (en]) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5930556U (ja) * | 1982-08-20 | 1984-02-25 | 株式会社ボッシュオートモーティブ システム | 燃料噴射弁の調整装置 |
-
1989
- 1989-11-09 JP JP1989130135U patent/JPH0727649Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0369265U (en]) | 1991-07-09 |
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